|
The International WISA Membrane
Technology Conference 2009, at Spier
in Stellenbosch from 13 to 15
May 2009, will bring together an
estimated 250 local and
international membrane industry
professionals to discuss the latest
developments in membrane research
and applications.
The format of the Spier event will
give delegates the opportunity to
take in the technical sessions from
Wednesday to Friday while enjoying
the friendly atmosphere of the meet
and greet reception on Tuesday, the
nomadic African village atmosphere
of the Moyo restaurant on Wednesday
and the gala dinner on Thursday
evening. There is also a half day
technical tour planned for Friday
that will focus on membrane
applications that are appropriate to
the needs of both developing and
industrialized countries.
The WISA Membrane Technology
Division invites you to actively
participate in this event by
registering for the conference,
being part of the exiting technical
programme that has been developed
and sponsoring the conference.
WISA is a not for profit
organisation and we strive to keep
conference registration fees as low
as possible to encourage
participation. Your valued
sponsorship will assist us in
keeping the conference registration
fees low while providing a high
quality conference experience.
Our venue, Spier Hotel, offers
outstanding facilities for us and
our valued sponsors to present their
organisations. Sponsors will benefit
from unrivalled networking
opportunities as well as a chance to
exchange ideas and solutions.
Below you will
find a link where you will be able
to download a list of sponsorship
categories and descriptions for you
to compose a sponsorship contract
that suits you best. Please note:
Sponsorship levels and features are
available on a first come, first
served basis. Please return
this document, signed as soon as
possible to secure your sponsorship
opportunity.
For any further
information please contact:
Contact Details:
Achim Wurster
WISA MTD Treasurer
Tel: +27 (11) 254 4800
Cell: +27 (0) 83 229 8347
awurster@golder.co.za
|